Advances in Chip Interconnect Technologies (Technical Insights) – This research service assesses the role of new interconnect technologies for electronics applications. On-chip interconnect technologies such as those interconnects based on optical links, wireless communication, nanotechnology or 3D integration, are evaluated in the research service. The emergence of novel interconnect technologies is expected to bring significant advantages to electronic devices allowing for increased speed, lower power consumption and enhanced reliability. The capabilities, technology trends and market readiness of emerging interconnect technologies have been assessed. Opportunity for different interconnect technologies are evaluated using a multiple criteria decision making tool called analytic hierarchy process.

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Table of Contents

Technology Snapshot and Trends

Chip Interconnect Technologies: Overview of Optical, Wireless, Nanotechnology-based Interconnect and 3D Integration Technologies
Technology Value Chain: Description of Each Stage of the Value Chain with Examples
Impact Assessment and Analysis

Market Impact of Technology Accelerators: Description of Key Drivers of Novel Interconnect Technologies
Market Impact of Technology Challenges: Description of Key Challenges of the Novel Interconnect Technologies
Key Industry Participants and Technology Innovations
Adoption Cycle and Needs Assessment

Technology Adoption Cycle
Demand Side Analysis
Opportunity Evaluation and Road mapping

Scenario Modeling and Emerging Opportunities
Technology/Application Roadmap
Evaluation of Opportunities For New Interconnect Technologies
Technology Management Strategies
Key Contacts
Key Patents
Appendix A – Analytical Hierarchy Process
Appendix B – Collaborative Initiatives
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