ReportsnReports: Inverter Technology Trends, Market & Supply Chain Analysis

15-Feb-2012 | News-Press Release

In order to illustrate advantages of new semiconductor devices, this report will provide a clear understanding of power module packaging evolution. Today, semiconductor manufacturers, power module makers and system integrators are looking for: more reliable interconnections, materials which withstand higher working temperature, and ways to remove or reduce cooling system size. Indeed, due to the higher switching frequencies and heat coming from external sources (external motors, high ambient temperature) semiconductor dies are getting closer to the heat dissipation system. This also means die attach materials are being investigated in order to maintain strong connection between the DBC and the semiconductor device. Copper wire bonds or Aluminum ribbon bonds are preferred to standard Aluminum technologies (which still represent 90% of the market), since they also support harsh working conditions. Another track for interconnection is foil-based solutions, which enable power module volume reduction, higher reliability to vibrations, connection of SMDs or other devices on top of the module and adoption of double sided cooling systems.

Of course, all these efforts are done because of entry of new semiconductor materials, but they are also done to fit with application requirements. This report highlights the drivers’ priority by application: today, some cost driven applications such as motor drives or UPS are not ready to implement those new types of modules because added cost of it is too important for the overall system. In parallel, PV inverters, trains or electric and hybrid vehicles are the key drivers for power packaging research.

Out of the standard material suppliers for the electronics industry, three types of power electronics companies are likely to work on R&D for power packaging:
• Semiconductor device and module makers, such as Infineon, Toshiba or Mitsubishi
• Power module makers like Semikron, GE Global Research or Starpower
• Inverter manufacturers like DENSO, Yaskawa, Alstom or BYD.

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Supply chain evolution: Vertical integration in ASIA; R&D services and diversification in Europe & North America

Power electronics now implies working with a broad spectrum of knowledge and know-how: mechanical, electrical, semiconductor, fluidics, hydraulics, connectors… Therefore, developments can be complicated and final products can be expensive.

As a consequence, we have observed and analyzed in this report the two main trends coming from the power electronics industry, which actually depends on the players locations:
• Japanese and Chinese players, especially from system makers tend to go downstream and master the manufacturing processes of each sub-system and component. In the case of Japanese companies, this tendency is mostly driven by cost reduction and absorption of intermediary margins, whereas Chinese companies want to access the technology and show some proof of quality
• On the other hand, EU and US players are more diversified, and acquisition of new competencies (such as Mersen, Rogers or Power Integration) or high-end R&D and prototyping services (APEI, Primes, IMEC, GE Global Research) is getting more common.

Major points covered in Table of Contents of this report include:
Glossary 3
Structure of the report 4
Executive summary 9
Technology briefing 33
Application-oriented analysis 42
PV inverters 44
EV/HEV 64
Wind turbines 98
Rail traction 118
UPS 139
Industrial motor drives 151
Analysis and global market forecasts 162
Compiled market forecasts 164
Market drivers and application specificities 181
Inverter architecture trends 188
Implementation of SiC and GaN materials in power electronics 200
Passive components, packaging and connectivity evolution 205
Supply chain 226
Global perspectives 238
General conclusions 243